01Responsibilities
Be part of the Optical Proximity Correction (OPC) team in the 300mm wafer fab located in Dholera, India.Work with Technology Transfer partner and understand / transfer OPC methodology to Dholera fab.Work with cross functional teams like Technology Development, Design Enablement and Lithography / Etch teams on OPC and develop models for different tool types and lithography conditions across multitude of technology nodes.Assist Business team in performance targets and cost analysisWork with TD teams on test chip layoutsResponsible for meeting project performance requirementsCompetitor benchmarking and Roadmap developmentPresentation to internal and customer senior executivesTravel as necessary
Essential Attributes:
Ability to work with cross functional teamsAble to work independently, self-motivated with a strong drive to win.Team player with the ability to work across diverse cross-functional teams spread across the world.Youre inclusive, adapting your style to the situation and diverse global norms of our people.An avid learner, you approach challenges with curiosity and resilience, seeking data to help build understanding.Youre collaborative, building relationships, humbly offering support and openly welcoming approaches.Innovative and creative, you proactively explore new ideas and adapt quickly to change.
Qualifications
B.S. in Electrical Engineering, Engineering Physics, Materials Science or equivalent; Masters & PhD holders can also applyStrong understanding of Semiconductor process, Customer design elements, Lithography process are required.Collaborative and Cross functional working with internal and external customers.Work seamlessly with Technology Development team, Design Enablement team, Lithography / Etch teams and develop Computational OPC solutions.To conceptualize thru pitch structures, Reticle Enhancement structures and work with CAD layout teams to develop test chip. Run silicon, collect data and develop OPC models for multitude of technology nodes.Knowledge of optical effects (Refraction, diffraction, flare, AR etc.,) required. Litho / etch CD, overlay data collection and analyze for model based OPC solutions.Knowledge of design enablement and tape-out systems and how OPC is part of the tape-out process.Familiarity with OPC modelling and rule setting processesInnovation mindset
Desired Experience Level
> 5 years experience in the Optical Proximity Correction area (OPC) areaKnowledge of Lithography process, tools and patterning aspects. End to end knowledge of OPC modelling and application aspects.Successful application of developed OPC models in Production environment & resolved yield limiting factors.Knowledge of Design of Experiments, Data Analytics, JMP, Anova and statistical analysis. .
