01Overview
Job Description
Core Responsibilities
Layer Layup & Alignment: Precisely stack inner cores, prepreg, and copper foils using registration pins to ensure perfect alignment. Machine Operation: Load and unload heavy steel plates and panels into large industrial bonding presses. Parameter Control: Program and monitor precise temperature, pressure, and vacuum profiles to melt and cure the resin without causing warping or air voids. Quality Inspection: Inspect bonded panels for defects, delamination, or misregistration using measurement tools and visual checks.
Key Requirements & Skills
Experience: 13 years in electronics manufacturing or printed circuit board fabrication. Technical Knowledge: Understanding of PCB stack-ups, material properties, and lamination profiles. Dexterity & Detail Orientation: High level of hand-eye coordination and attention to detail for handling fragile copper foils and insulating sheets. Physical Stamina: Ability to lift heavy steel press plates and stand for extended periods. .
